Integrated through-silicon-via-based inductor design in buck converter for improved efficiency
DOI:
https://doi.org/10.20998/2074-272X.2023.6.09Keywords:
through-silicon-via-based inductor, 3D integration, buck converter, efficiencyAbstract
Introduction. Through-silicon-via (TSV) is one of the most important components of 3D integrated circuits. Similar to two-dimensional circuits, the performance evaluation of 3D circuits depends on both the quality factor and inductance. Therefore, accurate TSV-inductor modeling is required for the design and analysis of 3D integrated circuits. Aim. This work proposes the equivalent circuit model of the TSV-inductor to derive the relations that determine both the quality factor and the inductance by Y-parameters. Methods. The model developed was simulated using MATLAB software, and it was used to evaluate the effect of redistribution lines width, TSV radius, and the number of turns on inductance and quality factor. Additionally, a comparative study was presented between TSV-based inductors and conventional inductors (i.e., spiral and racetrack inductors). Results. These studies show that replacing conventional inductors with TSV-inductors improved the quality factor by 64 % compared to a spiral inductor and 60 % compared to a racetrack inductor. Furthermore, the area of the TSV-inductor was reduced up to 1.2 mm². Using a PSIM simulator, the application of an integrated TSV-inductor in a buck converter was studied, and the simulation gave very good results in 3D integration compared to 2D integration. Moreover, the simulation results demonstrated that using a TSV-inductor in a buck converter could increase its efficiency by up to 15 % and 6 % compared to spiral and racetrack inductors, respectively.
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